Inventor
KIM HYUN JOUNG
KR11 patents
⚠️ This page may combine multiple inventors who share the name “KIM HYUN JOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
4 patentsUS7737539B2Jun 15, 2010
Integrated circuit package system including honeycomb molding
STATS CHIPPAC LTD30 citations91
US7443037B2Oct 28, 2008
Stacked integrated circuit package system with connection protection
STATS CHIPPAC LTD10 citations82
US7656017B2Feb 2, 2010
Integrated circuit package system with thermo-mechanical interlocking substrates
STATS CHIPPAC LTD14 citations80
US7687920B2Mar 30, 2010
Integrated circuit package-on-package system with central bond wires
STATS CHIPPAC LTD1 citations51