Inventor
ISODA KEIKO
JP29 patents
⚠️ This page may combine multiple inventors who share the name “ISODA KEIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
8 patentsUS6147374ANov 14, 2000
Resin-encapsulated semiconductor apparatus
HITACHI LTD60 citations97
US6465827B2Oct 15, 2002
Resin-encapsulated semiconductor apparatus and process for its fabrication
HITACHI LTD9 citations82
US6441416B1Aug 27, 2002
Resin-encapsulated semiconductor apparatus and process for its fabrication
HITACHI LTD8 citations82
US6657245B2Dec 2, 2003
Resin-encapsulated semiconductor apparatus and process for its fabrication
HITACHI LTD7 citations74
US6617630B2Sep 9, 2003
Resin-encapsulated semiconductor apparatus and process for its fabrication
HITACHI LTD4 citations74
US6525359B2Feb 25, 2003
Resin-encapsulated semiconductor apparatus and process for its fabrication
HITACHI LTD6 citations74
US6087006AJul 11, 2000
Surface-protecting film and resin-sealed semiconductor device having said film
HITACHI LTD10 citations73
US6200831B1Mar 13, 2001
Surface-protecting film and resin-sealed semiconductor device having said film
HITACHI LTD1 citations51
ISODA KEIKO
4 patentsUS8338757B2Dec 25, 2012
Cooking device
ISODA KEIKO77 citations95
US8164030B2Apr 24, 2012
Heating cooker with touch panel having user guiding illumination function
ISODA KEIKO10 citations81
US8772684B2Jul 8, 2014
Heating cooker having touch control
ISODA KEIKO7 citations70
US8604397B2Dec 10, 2013
Cooking device
ISODA KEIKO3 citations59
TOMINAGA HIROSHI
3 patentsRENESAS TECH CORP
3 patentsUS7064368B2Jun 20, 2006
Resin-encapsulated semiconductor apparatus and process for its fabrication
RENESAS TECH CORP9 citations82
US6847125B2Jan 25, 2005
Resin-encapsulated semiconductor apparatus and process for its fabrication
RENESAS TECH CORP10 citations82
US7521744B2Apr 21, 2009
Resin-encapsulated semiconductor apparatus and process for its fabrication
RENESAS TECH CORP2 citations63