Inventor

OSTERHELD THOMAS H

US70 patents

⚠️ This page may combine multiple inventors who share the name “OSTERHELD THOMAS H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OSTERHELD THOMAS H

APPLIED MATERIALS INC

Polishing pad having a grooved pattern for use in chemical mechanical polishing

Carrier head with a multilayer retaining ring for chemical mechanical polishing

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Polishing pad having a grooved pattern for use in chemical mechanical polishing

Chemical mechanical polishing processes and components

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Method and apparatus for chemical mechanical polishing using a patterned pad

Acoustic emission monitoring and endpoint for chemical mechanical polishing

Multilayer retaining ring for chemical mechanical polishing

Methods for a multilayer retaining ring

Carrier head with a multilayer retaining ring for chemical mechanical polishing

Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane

Technique for chemical mechanical polishing silicon

Profile control platen

Carrier head with a modified flexible membrane

Closed loop control over delivery of liquid material to semiconductor processing tool

Method of post CMP defect stability improvement

Methods and compositions for chemical mechanical polishing shallow trench isolation substrates

Substrate polishing with reduced contamination

Polishing processes for shallow trench isolation substrates

Method of post CMP defect stability improvement

Chemical mechanical polishing apparatus and methods

Dynamic residue clearing control with in-situ profile control (ISPC)

Thin polishing pad with window and molding process

Retaining ring monitoring and control of pressure

Weighted regression of thickness maps from spectral data

Pad conditioner

Closed loop control over delivery of liquid material to semiconductor processing tool

Control of processing parameters for substrate polishing with angularly distributed zones using cost function

Monitoring of polishing pad texture in chemical mechanical polishing

Consumable part monitoring in chemical mechanical polisher

Polishing system with annular platen or polishing pad for substrate monitoring

Multi-platen multi-head polishing architecture

Machine vision as input to a CMP process control algorithm

Training spectrum generation for machine learning system for spectrographic monitoring

Chemical mechanical polishing a substrate having a filler layer and a stop layer

Textured small pad for chemical mechanical polishing

Utility wafer for chemical mechanical polishing

Chemical mechanical polishing automated recipe generation

Chemical mechanical polishing vibration measurement using optical sensor

Consumable part monitoring in chemical mechanical polisher

XU KUN

Temperature control of chemical mechanical polishing

Use of pad conditioning in temperature controlled CMP

QIAN JUN

Polishing pad and system with window support

Selecting reference libraries for monitoring of multiple zones on a substrate

BENVEGNU DOMINIC J

Thin polishing pad with window and molding process

BENNETT DOYLE E

Eddy current gain compensation