Inventor

KIGAWA AKIKO

JP3 patents

Patents

3 patents

US10475676B2Nov 12, 2019

Workpiece processing method

DISCO CORP1 citations56

US11145533B2Oct 12, 2021

Expanding method

DISCO CORP0 citations47

US11810807B2Nov 7, 2023

Processing apparatus configured for processing wafers continuously under different processing conditions

DISCO CORP0 citations44