Inventor
LIM SHEAU HOOI
MY4 patents
Patents
4 patentsUS7088010B2Aug 8, 2006
Chip packaging compositions, packages and systems made therewith, and methods of making same
INTEL CORP7 citations71
US7291548B2Nov 6, 2007
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
INTEL CORP5 citations70
US7253088B2Aug 7, 2007
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
INTEL CORP3 citations59
US7244634B2Jul 17, 2007
Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
INTEL CORP5 citations57