Inventor
WEALE RICHARD D
US3 patents
Patents
3 patentsUS5128008AJul 7, 1992
Method of forming a microelectronic package having a copper substrate
IBM22 citations90
US5288541AFeb 22, 1994
Method for metallizing through holes in thin film substrates, and resulting devices
IBM26 citations89
US5525369AJun 11, 1996
Method for metallizing through holes in thin film substrates, and resulting devices
IBM16 citations79