Inventor

MAKINO NOBUYA

JP3 patents

Patents

3 patents

US7285854B2Oct 23, 2007

Wire bonding method and semiconductor device

DENSO CORP27 citations91

US7470996B2Dec 30, 2008

Packaging method

DENSO CORP32 citations90

US7405478B2Jul 29, 2008

Substrate package structure and packaging method thereof

DENSO CORP20 citations89