Inventor

KUO YEN-HUA

TW2 patents

Patents

2 patents

US8866311B2Oct 21, 2014

Semiconductor package substrates having pillars and related methods

ADVANCED SEMICONDUCTOR ENG0 citations48

US8686568B2Apr 1, 2014

Semiconductor package substrates having layered circuit segments, and related methods

ADVANCED SEMICONDUCTOR ENG0 citations45