P

Inventor

MATSUSHITA YOSHIAKI

JP36 patents
⚠️ This page may combine multiple inventors who share the name “MATSUSHITA YOSHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOSHIBA KK

24 patents
US5246500ASep 21, 1993

Vapor phase epitaxial growth apparatus

TOSHIBA KK604 citations99
US5698869ADec 16, 1997

Insulated-gate transistor having narrow-bandgap-source

TOSHIBA KK415 citations98
US5124276AJun 23, 1992

Filling contact hole with selectively deposited EPI and poly silicon

TOSHIBA KK44 citations96
US4645546AFeb 24, 1987

Semiconductor substrate

TOSHIBA KK63 citations96
US5514904AMay 7, 1996

Semiconductor device with monocrystalline gate insulating film

TOSHIBA KK57 citations95
US5994756ANov 30, 1999

Substrate having shallow trench isolation

TOSHIBA KK56 citations94
US5071776ADec 10, 1991

Wafer processsing method for manufacturing wafers having contaminant-gettering damage on one surface

TOSHIBA KK74 citations93
US6008110ADec 28, 1999

Semiconductor substrate and method of manufacturing same

TOSHIBA KK27 citations92
US5675176AOct 7, 1997

Semiconductor device and a method for manufacturing the same

TOSHIBA KK43 citations92
US4894206AJan 16, 1990

Crystal pulling apparatus

TOSHIBA KK33 citations92
US4885257ADec 5, 1989

Gettering process with multi-step annealing and inert ion implantation

TOSHIBA KK40 citations92
US4787997ANov 29, 1988

Etching solution for evaluating crystal faults

TOSHIBA KK26 citations92
US6919260B1Jul 19, 2005

Method of manufacturing a substrate having shallow trench isolation

TOSHIBA KK16 citations82
US5057899AOct 15, 1991

Semiconductor device with improved wiring contact portion

TOSHIBA KK21 citations82
US5220191AJun 15, 1993

Semiconductor device having a well electrically insulated from the substrate

TOSHIBA KK17 citations74
US5116780AMay 26, 1992

Method of manufacturing a semiconductor device having improved contact resistance characteristics

TOSHIBA KK13 citations74
US5004702AApr 2, 1991

Preparation method of selective growth silicon layer doped with impurities

TOSHIBA KK19 citations74
US4894349AJan 16, 1990

Two step vapor-phase epitaxial growth process for control of autodoping

TOSHIBA KK18 citations74
US4579601AApr 1, 1986

Method of growing a resistive epitaxial layer on a short lifetime epi-layer

TOSHIBA KK12 citations74
US5739575AApr 14, 1998

Dielectrically isolated substrate and method for manufacturing the same

TOSHIBA KK16 citations73
US5574307ANov 12, 1996

Semiconductor device and method of producing the same

TOSHIBA KK9 citations73
US5148457ASep 15, 1992

System for analyzing metal impurity on the surface of a single crystal semiconductor by using total reflection of x-rays fluorescence

TOSHIBA KK14 citations73
US4862000AAug 29, 1989

Method for predicting density of micro crystal defects in semiconductor element from silicon wafer used in the manufacture of the element, and infrared absorption measurement apparatus for this method

TOSHIBA KK17 citations71
US4837610AJun 6, 1989

Insulation film for a semiconductor device

TOSHIBA KK2 citations59

VLSI TECHNOLOGY RES ASS

4 patents

HITACHI SHIPBUILDING ENG CO

3 patents

HITACHI LTD

2 patents

NGK INSULATORS LTD

2 patents

TOKYO SHIBAURA ELECTRIC CO

1 patent