Inventor
MATSUSHITA YOSHIAKI
JP36 patents
⚠️ This page may combine multiple inventors who share the name “MATSUSHITA YOSHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
24 patentsUS5246500ASep 21, 1993
Vapor phase epitaxial growth apparatus
TOSHIBA KK604 citations99
US5698869ADec 16, 1997
Insulated-gate transistor having narrow-bandgap-source
TOSHIBA KK415 citations98
US5124276AJun 23, 1992
Filling contact hole with selectively deposited EPI and poly silicon
TOSHIBA KK44 citations96
US4645546AFeb 24, 1987
Semiconductor substrate
TOSHIBA KK63 citations96
US5514904AMay 7, 1996
Semiconductor device with monocrystalline gate insulating film
TOSHIBA KK57 citations95
US5994756ANov 30, 1999
Substrate having shallow trench isolation
TOSHIBA KK56 citations94
US5071776ADec 10, 1991
Wafer processsing method for manufacturing wafers having contaminant-gettering damage on one surface
TOSHIBA KK74 citations93
US6008110ADec 28, 1999
Semiconductor substrate and method of manufacturing same
TOSHIBA KK27 citations92
US5675176AOct 7, 1997
Semiconductor device and a method for manufacturing the same
TOSHIBA KK43 citations92
US4894206AJan 16, 1990
Crystal pulling apparatus
TOSHIBA KK33 citations92
US4885257ADec 5, 1989
Gettering process with multi-step annealing and inert ion implantation
TOSHIBA KK40 citations92
US4787997ANov 29, 1988
Etching solution for evaluating crystal faults
TOSHIBA KK26 citations92
US6919260B1Jul 19, 2005
Method of manufacturing a substrate having shallow trench isolation
TOSHIBA KK16 citations82
US5057899AOct 15, 1991
Semiconductor device with improved wiring contact portion
TOSHIBA KK21 citations82
US5220191AJun 15, 1993
Semiconductor device having a well electrically insulated from the substrate
TOSHIBA KK17 citations74
US5116780AMay 26, 1992
Method of manufacturing a semiconductor device having improved contact resistance characteristics
TOSHIBA KK13 citations74
US5004702AApr 2, 1991
Preparation method of selective growth silicon layer doped with impurities
TOSHIBA KK19 citations74
US4894349AJan 16, 1990
Two step vapor-phase epitaxial growth process for control of autodoping
TOSHIBA KK18 citations74
US4579601AApr 1, 1986
Method of growing a resistive epitaxial layer on a short lifetime epi-layer
TOSHIBA KK12 citations74
US5739575AApr 14, 1998
Dielectrically isolated substrate and method for manufacturing the same
TOSHIBA KK16 citations73
US5574307ANov 12, 1996
Semiconductor device and method of producing the same
TOSHIBA KK9 citations73
US5148457ASep 15, 1992
System for analyzing metal impurity on the surface of a single crystal semiconductor by using total reflection of x-rays fluorescence
TOSHIBA KK14 citations73
US4862000AAug 29, 1989
Method for predicting density of micro crystal defects in semiconductor element from silicon wafer used in the manufacture of the element, and infrared absorption measurement apparatus for this method
TOSHIBA KK17 citations71
US4837610AJun 6, 1989
Insulation film for a semiconductor device
TOSHIBA KK2 citations59
VLSI TECHNOLOGY RES ASS
4 patentsUS4314595AFeb 9, 1982
Method of forming nondefective zone in silicon single crystal wafer by two stage-heat treatment
VLSI TECHNOLOGY RES ASS179 citations96
US4376657AMar 15, 1983
Method of making fault-free surface zone in semiconductor devices by step-wise heat treating
VLSI TECHNOLOGY RES ASS107 citations93
US4193783AMar 18, 1980
Method of treating a silicon single crystal ingot
VLSI TECHNOLOGY RES ASS21 citations82
US4378269AMar 29, 1983
Method of manufacturing a single crystal silicon rod
VLSI TECHNOLOGY RES ASS18 citations72