Inventor

CHANG WEN-YUAN

TW41 patents

⚠️ This page may combine multiple inventors who share the name “CHANG WEN-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG WEN-YUAN

VIA TECH INC

Arrangement of conductive pads on grid array package and on circuit board

Chip embedded package structure

Flip chip die

Grid array packaged integrated circuit

Chip package and coreless package substrate thereof

Process for fabricating chip embedded package structure

Semiconductor packaging substrate and method of producing the same

Probe card

Circuit substrate

Fabrication method of circuit board

Chip package and substrate thereof

Incorrect-placement preventing directional IC tray for carrying IC packages

Probe card

Probe card

Process for fabricating a circuit substrate

Semiconductor packaging substrate and method of producing the same

Grid array package with increased electrical grounding routes and method of fabrication

Chip and manufacturing method and application thereof

Package substrate, chip package and integrated circuit chip

CHANG WEN-YUAN

Chip package structure

Chip package structure and package substrate

Integrated circuit package and physical layer interface arrangement

Circuit board and chip package structure

Operating method and changer for optical module/printer module system

Optical scanner

VIA ALLIANCE SEMICONDUCTOR CO LTD

Electronic structure process

Electronic structure, and electronic structure array

Chip package array, and chip package

Chip package process

Electronic package assembly

TRANSPACIFIC IP LTD

Scanner carrier

[Operating method and changer for optical module/printer module system]

Scanner carrier

SHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD

Chip package structure and chip package structure array

Chip packaging method

AU OPTRONICS CORP

Shock absorbent packaging structure

Package structure for panel module and method using the same

TAIWAN SEMICONDUCTOR MFG

Resistive memory device having enhanced resist ratio and method of manufacturing same

CHANG WEN YUAN

Conveyor-belt linking apparatus of metallurgical furnace

TRANSPACIFIC SYSTEMS LLC

Apparatus compensating a scanned object for optical characteristics according to light sources of different wavelengths

UMAX DATA SYSTEMS INC

Apparatus compensating a scanned object for optical characteristics according to light sources of different wavelengths