Inventor

SEOK SEUNGDAE

KR4 patents

Patents

4 patents

US12027401B2Jul 2, 2024

Semiconductor substrate alignment device and a semiconductor substrate bonding system using the same

SAMSUNG ELECTRONICS CO LTD2 citations63

US11443965B2Sep 13, 2022

Wafer to wafer bonding apparatuses

SAMSUNG ELECTRONICS CO LTD1 citations53

US12580158B2Mar 17, 2026

Plasma processing apparatus, substrate bonding system including the same, and substrate bonding method using the same

SAMSUNG ELECTRONICS CO LTD0 citations42

US10784130B2Sep 22, 2020

Bonding apparatus

SAMSUNG ELECTRONICS CO LTD0 citations32