Inventor
MATSUKI HIROHISA
JP48 patents
⚠️ This page may combine multiple inventors who share the name “MATSUKI HIROHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
33 patentsUS6881611B1Apr 19, 2005
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
FUJITSU LTD85 citations98
US6548898B2Apr 15, 2003
External connection terminal and semiconductor device
FUJITSU LTD98 citations98
US6218281B1Apr 17, 2001
Semiconductor device with flip chip bonding pads and manufacture thereof
FUJITSU LTD162 citations98
US7084513B2Aug 1, 2006
Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
FUJITSU LTD91 citations97
US7064436B2Jun 20, 2006
Semiconductor device and method of fabricating the same
FUJITSU LTD81 citations97
US6232147B1May 15, 2001
Method for manufacturing semiconductor device with pad structure
FUJITSU LTD133 citations97
US5969424AOct 19, 1999
Semiconductor device with pad structure
FUJITSU LTD258 citations97
US6836025B2Dec 28, 2004
Semiconductor device configured to be surface mountable
FUJITSU LTD61 citations96
US6455920B2Sep 24, 2002
Semiconductor device having a ball grid array and a fabrication process thereof
FUJITSU LTD72 citations96
US6344407B1Feb 5, 2002
Method of manufacturing solder bumps and solder joints using formic acid
FUJITSU LTD75 citations96
US6939142B2Sep 6, 2005
Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece
FUJITSU LTD30 citations93
US6666369B2Dec 23, 2003
Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment
FUJITSU LTD34 citations93
US6566239B2May 20, 2003
Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating
FUJITSU LTD38 citations93
US7112889B1Sep 26, 2006
Semiconductor device having an alignment mark formed by the same material with a metal post
FUJITSU LTD36 citations92
US7064047B2Jun 20, 2006
Semiconductor device having a ball grid array and a fabrication process thereof
FUJITSU LTD16 citations92
US7064645B2Jun 20, 2006
Electronic device
FUJITSU LTD46 citations92
US6987054B2Jan 17, 2006
Method of fabricating a semiconductor device having a groove formed in a resin layer
FUJITSU LTD12 citations92
US6909181B2Jun 21, 2005
Light signal processing system
FUJITSU LTD34 citations92
US6784543B2Aug 31, 2004
External connection terminal and semiconductor device
FUJITSU LTD30 citations92
US6784542B2Aug 31, 2004
Semiconductor device having a ball grid array and a fabrication process thereof
FUJITSU LTD15 citations92
US6732911B2May 11, 2004
Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
FUJITSU LTD35 citations92
US6696754B2Feb 24, 2004
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD20 citations92
US6680241B2Jan 20, 2004
Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices
FUJITSU LTD40 citations92
US6657282B2Dec 2, 2003
Semiconductor device having a ball grid array and a fabrication process thereof
FUJITSU LTD19 citations92
US6511620B1Jan 28, 2003
Method of producing semiconductor devices having easy separability from a metal mold after molding
FUJITSU LTD35 citations92
US6471501B1Oct 29, 2002
Mold for fabricating semiconductor devices
FUJITSU LTD53 citations92
US6472744B2Oct 29, 2002
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD31 citations92
US6469370B1Oct 22, 2002
Semiconductor device and method of production of the semiconductor device
FUJITSU LTD54 citations92
US7405137B2Jul 29, 2008
Method of dicing a semiconductor substrate into a plurality of semiconductor chips by forming two cutting grooves on one substrate surface and forming one cutting groove on an opposite substrate surface that overlaps the two cutting grooves
FUJITSU LTD12 citations84
US7233076B2Jun 19, 2007
Semiconductor device with read out prevention and method of producing same
FUJITSU LTD7 citations74
US5633532AMay 27, 1997
Semiconductor device interconnection
FUJITSU LTD17 citations68
US7240432B2Jul 10, 2007
Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece
FUJITSU LTD4 citations63
US6734042B2May 11, 2004
Semiconductor device and method for fabricating the same
FUJITSU LTD0 citations52
MATSUKI HIROHISA
4 patentsUS8952538B2Feb 10, 2015
Semiconductor device and method for manufacturing the same
MATSUKI HIROHISA16 citations92
US8395260B2Mar 12, 2013
Semiconductor device and manufacturing method thereof
MATSUKI HIROHISA12 citations83
US8084277B2Dec 27, 2011
Semiconductor device and manufacturing method thereof
MATSUKI HIROHISA2 citations62
US8994153B2Mar 31, 2015
Semiconductor device having antenna element and method of manufacturing same
MATSUKI HIROHISA0 citations51
FUJITSU SEMICONDUCTOR LTD
4 patentsUS7863745B2Jan 4, 2011
Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
FUJITSU SEMICONDUCTOR LTD8 citations84
US7759246B2Jul 20, 2010
Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
FUJITSU SEMICONDUCTOR LTD9 citations84
US8759119B2Jun 24, 2014
Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
FUJITSU SEMICONDUCTOR LTD2 citations62
US9893029B2Feb 13, 2018
Semiconductor device and method for manufacturing the same
FUJITSU SEMICONDUCTOR LTD0 citations52