Inventor
KORZENSKI MICHAEL B
US30 patents
⚠️ This page may combine multiple inventors who share the name “KORZENSKI MICHAEL B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED TECH MATERIALS
16 patentsUS7960328B2Jun 14, 2011
Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
ADVANCED TECH MATERIALS53 citations97
US7922824B2Apr 12, 2011
Oxidizing aqueous cleaner for the removal of post-etch residues
ADVANCED TECH MATERIALS57 citations97
US7119418B2Oct 10, 2006
Supercritical fluid-assisted deposition of materials on semiconductor substrates
ADVANCED TECH MATERIALS31 citations93
US6735978B1May 18, 2004
Treatment of supercritical fluid utilized in semiconductor manufacturing applications
ADVANCED TECH MATERIALS31 citations93
US7223352B2May 29, 2007
Supercritical carbon dioxide/chemical formulation for ashed and unashed aluminum post-etch residue removal
ADVANCED TECH MATERIALS26 citations92
US7160815B2Jan 9, 2007
Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
ADVANCED TECH MATERIALS28 citations92
US7119052B2Oct 10, 2006
Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers
ADVANCED TECH MATERIALS46 citations92
US6989358B2Jan 24, 2006
Supercritical carbon dioxide/chemical formulation for removal of photoresists
ADVANCED TECH MATERIALS20 citations92
US6943139B2Sep 13, 2005
Removal of particle contamination on patterned silicon/silicon dioxide using supercritical carbon dioxide/chemical formulations
ADVANCED TECH MATERIALS24 citations92
US8026200B2Sep 27, 2011
Low pH mixtures for the removal of high density implanted resist
ADVANCED TECH MATERIALS19 citations91
US9649712B2May 16, 2017
Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
ADVANCED TECH MATERIALS6 citations84
US7557073B2Jul 7, 2009
Non-fluoride containing supercritical fluid composition for removal of ion-implant photoresist
ADVANCED TECH MATERIALS14 citations84
US7553803B2Jun 30, 2009
Enhancement of silicon-containing particulate material removal using supercritical fluid-based compositions
ADVANCED TECH MATERIALS19 citations84
US7517809B2Apr 14, 2009
Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
ADVANCED TECH MATERIALS5 citations63
US9443713B2Sep 13, 2016
Oxidizing aqueous cleaner for the removal of post-etch residues
ADVANCED TECH MATERIALS2 citations62
US9158203B2Oct 13, 2015
Compositions and methods for the selective removal of silicon nitride
ADVANCED TECH MATERIALS2 citations59
ENTEGRIS INC
3 patentsUS9731368B2Aug 15, 2017
Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
ENTEGRIS INC5 citations84
US9691629B2Jun 27, 2017
Compositions and methods for the selective removal of silicon nitride
ENTEGRIS INC3 citations70
US10034387B2Jul 24, 2018
Method for recycling of obsolete printed circuit boards
ENTEGRIS INC0 citations48
CHEN TIANNIU
2 patentsRATH MELISSA K
2 patentsUS8058219B2Nov 15, 2011
Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchant
RATH MELISSA K25 citations91
US8338087B2Dec 25, 2012
Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
RATH MELISSA K19 citations82