Inventor
BJORKMAN CLAES H
US15 patents
⚠️ This page may combine multiple inventors who share the name “BJORKMAN CLAES H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
12 patentsUS6340435B1Jan 22, 2002
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC536 citations98
US6949203B2Sep 27, 2005
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
APPLIED MATERIALS INC69 citations97
US6858153B2Feb 22, 2005
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC256 citations97
US6902947B2Jun 7, 2005
Integrated method for release and passivation of MEMS structures
APPLIED MATERIALS INC89 citations96
US6669858B2Dec 30, 2003
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC47 citations95
US6362109B1Mar 26, 2002
Oxide/nitride etching having high selectivity to photoresist
APPLIED MATERIALS INC73 citations93
US7227244B2Jun 5, 2007
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC27 citations92
US6500357B1Dec 31, 2002
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene
APPLIED MATERIALS INC38 citations92
US7458335B1Dec 2, 2008
Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils
APPLIED MATERIALS INC9 citations84
US7407081B2Aug 5, 2008
Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
APPLIED MATERIALS INC8 citations72
US7105442B2Sep 12, 2006
Ashable layers for reducing critical dimensions of integrated circuit features
APPLIED MATERIALS INC9 citations71
US9502294B2Nov 22, 2016
Method and system for wafer level singulation
APPLIED MATERIALS INC0 citations52