Inventor
CHEUNG DAVID W
US16 patents
⚠️ This page may combine multiple inventors who share the name “CHEUNG DAVID W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
13 patentsUS6593247B1Jul 15, 2003
Method of depositing low k films using an oxidizing plasma
APPLIED MATERIALS INC129 citations99
US6413583B1Jul 2, 2002
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
APPLIED MATERIALS INC725 citations99
US5844195ADec 1, 1998
Remote plasma source
APPLIED MATERIALS INC388 citations99
US6340435B1Jan 22, 2002
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC536 citations98
US6858153B2Feb 22, 2005
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC256 citations97
US6709715B1Mar 23, 2004
Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds
APPLIED MATERIALS INC109 citations97
US5817406AOct 6, 1998
Ceramic susceptor with embedded metal electrode and brazing material connection
APPLIED MATERIALS INC61 citations96
US6669858B2Dec 30, 2003
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC47 citations95
US5633073AMay 27, 1997
Ceramic susceptor with embedded metal electrode and eutectic connection
APPLIED MATERIALS INC81 citations94
US7227244B2Jun 5, 2007
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC27 citations92
US7160821B2Jan 9, 2007
Method of depositing low k films
APPLIED MATERIALS INC25 citations92
US6806207B2Oct 19, 2004
Method of depositing low K films
APPLIED MATERIALS INC34 citations92
US5626678AMay 6, 1997
Non-conductive alignment member for uniform plasma processing of substrates
APPLIED MATERIALS INC37 citations92