Inventor
LIU KUOWEI
US18 patents
Patents
18 patentsUS6627532B1Sep 30, 2003
Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition
APPLIED MATERIALS INC358 citations99
US6593247B1Jul 15, 2003
Method of depositing low k films using an oxidizing plasma
APPLIED MATERIALS INC129 citations99
US6511909B1Jan 28, 2003
Method of depositing a low K dielectric with organo silane
APPLIED MATERIALS INC100 citations99
US6511903B1Jan 28, 2003
Method of depositing a low k dielectric with organo silane
APPLIED MATERIALS INC91 citations99
US6072227AJun 6, 2000
Low power method of depositing a low k dielectric with organo silane
APPLIED MATERIALS INC541 citations99
US6054379AApr 25, 2000
Method of depositing a low k dielectric with organo silane
APPLIED MATERIALS INC609 citations99
US6340435B1Jan 22, 2002
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC536 citations98
US6858153B2Feb 22, 2005
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC256 citations97
US7023092B2Apr 4, 2006
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds
APPLIED MATERIALS INC25 citations96
US6770556B2Aug 3, 2004
Method of depositing a low dielectric with organo silane
APPLIED MATERIALS INC29 citations96
US6730593B2May 4, 2004
Method of depositing a low K dielectric with organo silane
APPLIED MATERIALS INC60 citations96
US6669858B2Dec 30, 2003
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC47 citations95
US7227244B2Jun 5, 2007
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC27 citations92
US7160821B2Jan 9, 2007
Method of depositing low k films
APPLIED MATERIALS INC25 citations92
US6806207B2Oct 19, 2004
Method of depositing low K films
APPLIED MATERIALS INC34 citations92
US6784119B2Aug 31, 2004
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
APPLIED MATERIALS INC36 citations92
US7651725B2Jan 26, 2010
Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond
APPLIED MATERIALS INC7 citations74
US7074708B2Jul 11, 2006
Method of decreasing the k value in sioc layer deposited by chemical vapor deposition
APPLIED MATERIALS INC8 citations74