Inventor
KIM YUNSANG
US56 patents
⚠️ This page may combine multiple inventors who share the name “KIM YUNSANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
20 patentsUS7858898B2Dec 28, 2010
Bevel etcher with gap control
LAM RES CORP349 citations99
US9881788B2Jan 30, 2018
Back side deposition apparatus and applications
LAM RES CORP372 citations97
US7943007B2May 17, 2011
Configurable bevel etcher
LAM RES CORP24 citations92
US7651585B2Jan 26, 2010
Apparatus for the removal of an edge polymer from a substrate and methods therefor
LAM RES CORP27 citations92
US7909960B2Mar 22, 2011
Apparatus and methods to remove films on bevel edge and backside of wafer
LAM RES CORP11 citations84
US7718542B2May 18, 2010
Low-k damage avoidance during bevel etch processing
LAM RES CORP8 citations82
US9564308B2Feb 7, 2017
Methods for processing bevel edge etching
LAM RES CORP2 citations73
US7140374B2Nov 28, 2006
System, method and apparatus for self-cleaning dry etch
LAM RES CORP8 citations73
US7129167B1Oct 31, 2006
Methods and systems for a stress-free cleaning a surface of a substrate
LAM RES CORP10 citations73
US10629458B2Apr 21, 2020
Control of bevel etch film profile using plasma exclusion zone rings larger than the wafer diameter
LAM RES CORP1 citations72
US8349202B2Jan 8, 2013
Methods for controlling bevel edge etching in a plasma chamber
LAM RES CORP5 citations71
US10714345B2Jul 14, 2020
Plasma assisted doping on germanium
LAM RES CORP1 citations61
US10431462B2Oct 1, 2019
Plasma assisted doping on germanium
LAM RES CORP1 citations61
US10217610B2Feb 26, 2019
Arrangements for manipulating plasma confinement within a plasma processing system and methods thereof
LAM RES CORP1 citations61
US10068981B2Sep 4, 2018
Rare earth metal surface-activated plasma doping on semiconductor substrates
LAM RES CORP0 citations52
US9281166B2Mar 8, 2016
Plasma processing chamber for bevel edge processing
LAM RES CORP0 citations52
US8673111B2Mar 18, 2014
Plasma processing chamber for bevel edge processing
LAM RES CORP0 citations52
US10832923B2Nov 10, 2020
Lower plasma-exclusion-zone rings for a bevel etcher
LAM RES CORP0 citations51
US10811282B2Oct 20, 2020
Upper plasma-exclusion-zone rings for a bevel etcher
LAM RES CORP0 citations51
US10748747B2Aug 18, 2020
Edge exclusion control with adjustable plasma exclusion zone ring
LAM RES CORP0 citations51
APPLIED MATERIALS INC
11 patentsUS6340435B1Jan 22, 2002
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC536 citations98
US7316761B2Jan 8, 2008
Apparatus for uniformly etching a dielectric layer
APPLIED MATERIALS INC178 citations97
US6858153B2Feb 22, 2005
Integrated low K dielectrics and etch stops
APPLIED MATERIALS INC256 citations97
US6403491B1Jun 11, 2002
Etch method using a dielectric etch chamber with expanded process window
APPLIED MATERIALS INC396 citations97
US6669858B2Dec 30, 2003
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC47 citations95
US7227244B2Jun 5, 2007
Integrated low k dielectrics and etch stops
APPLIED MATERIALS INC27 citations92
US7132369B2Nov 7, 2006
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC27 citations92
US7435685B2Oct 14, 2008
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC13 citations83
US7256134B2Aug 14, 2007
Selective etching of carbon-doped low-k dielectrics
APPLIED MATERIALS INC16 citations82
US6686293B2Feb 3, 2004
Method of etching a trench in a silicon-containing dielectric material
APPLIED MATERIALS INC18 citations80
US6511920B2Jan 28, 2003
Optical marker layer for etch endpoint determination
APPLIED MATERIALS INC5 citations63
BAILEY III ANDREW D
5 patentsUS9053925B2Jun 9, 2015
Configurable bevel etcher
BAILEY III ANDREW D6 citations83
US8414790B2Apr 9, 2013
Bevel plasma treatment to enhance wet edge clean
BAILEY III ANDREW D5 citations73
US8440051B2May 14, 2013
Plasma processing chamber for bevel edge processing
BAILEY III ANDREW D0 citations52
US8268116B2Sep 18, 2012
Methods of and apparatus for protecting a region of process exclusion adjacent to a region of process performance in a process chamber
BAILEY III ANDREW D0 citations52
US8211238B2Jul 3, 2012
System, method and apparatus for self-cleaning dry etch
BAILEY III ANDREW D1 citations51
KIM YUNSANG
3 patentsFANG TONG
2 patentsLG DISPLAY CO LTD
2 patentsAPPLLIED MATERIALS INC
1 patentCHEN JACK
1 patentSWAMI GANAPATHY
1 patentSEXTON GREGORY S
1 patentYOON HYUNGSUK ALEXANDER
1 patentKIM KEECHAN
1 patentSHIN NEUNGHO
1 patentShowing the top 50 of 56 patents by PatentIndex Score.