Inventor
MIYAKAWA MASAFUMI
JP3 patents
Patents
3 patentsUS7201969B2Apr 10, 2007
Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
MITSUI CHEMICALS INC26 citations90
US7238421B2Jul 3, 2007
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film
MITSUI CHEMICALS INC0 citations49
US7501312B2Mar 10, 2009
Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer
MITSUI CHEMICALS INC1 citations48