Inventor
KIM HAN-JU
KR20 patents
⚠️ This page may combine multiple inventors who share the name “KIM HAN-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS7536623B2May 19, 2009
Method and apparatus for generating a low-density parity check code
SAMSUNG ELECTRONICS CO LTD48 citations92
US7454685B2Nov 18, 2008
Method and apparatus for decoding low density parity check code using united node processing
SAMSUNG ELECTRONICS CO LTD33 citations92
US7631241B2Dec 8, 2009
Apparatus and method for decoding low density parity check codes
SAMSUNG ELECTRONICS CO LTD10 citations84
US12301353B2May 13, 2025
Method and apparatus for transmitting and receiving control information in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations62
US11764900B2Sep 19, 2023
Method and apparatus for transmitting and receiving control information in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations62
US11463196B2Oct 4, 2022
Method and apparatus for transmitting and receiving control information in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations62
US10917193B2Feb 9, 2021
Method and apparatus for transmitting and receiving control information in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations62
US7779328B2Aug 17, 2010
Method and apparatus for efficiently decoding concatenated burst in a WiBro system
SAMSUNG ELECTRONICS CO LTD5 citations62
US10734258B2Aug 4, 2020
Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same
SAMSUNG ELECTRONICS CO LTD1 citations57
US9491754B2Nov 8, 2016
Method and apparatus for transmitting/receiving UE reference signal with selective muting in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations52
US7747931B2Jun 29, 2010
Apparatus and method for decoding burst in an OFDMA mobile communication system
SAMSUNG ELECTRONICS CO LTD0 citations47
US9922846B2Mar 20, 2018
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations43
DONGBU DAEWOO ELECTRONICS CORP
5 patentsUS9629499B2Apr 25, 2017
Convection cooking apparatus
DONGBU DAEWOO ELECTRONICS CORP80 citations97
US9341382B2May 17, 2016
Cooking apparatus
DONGBU DAEWOO ELECTRONICS CORP81 citations97
US10405696B2Sep 10, 2019
Cooking apparatus
DONGBU DAEWOO ELECTRONICS CORP11 citations83
US9055842B2Jun 16, 2015
Cooking container for electronic oven
DONGBU DAEWOO ELECTRONICS CORP11 citations83
US9526374B2Dec 27, 2016
Cooking apparatus
DONGBU DAEWOO ELECTRONICS CORP6 citations72