Inventor
HARVEY PAUL M
US14 patents
⚠️ This page may combine multiple inventors who share the name “HARVEY PAUL M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
3M INNOVATIVE PROPERTIES CO
4 patentsUS6140707AOct 31, 2000
Laminated integrated circuit package
3M INNOVATIVE PROPERTIES CO221 citations97
US7064412B2Jun 20, 2006
Electronic package with integrated capacitor
3M INNOVATIVE PROPERTIES CO60 citations94
US6150071ANov 21, 2000
Fabrication process for flex circuit applications
3M INNOVATIVE PROPERTIES CO8 citations72
US7388275B2Jun 17, 2008
Electronic package with integrated capacitor
3M INNOVATIVE PROPERTIES CO0 citations50
HARVEY PAUL M
4 patentsUS8440917B2May 14, 2013
Method and apparatus to reduce impedance discontinuity in packages
HARVEY PAUL M7 citations82
US8791372B2Jul 29, 2014
Reducing impedance discontinuity in packages
HARVEY PAUL M4 citations71
US8338949B2Dec 25, 2012
System to improve coreless package connections
HARVEY PAUL M0 citations48
US8222739B2Jul 17, 2012
System to improve coreless package connections
HARVEY PAUL M0 citations48
IBM
4 patentsUS7687391B2Mar 30, 2010
Electrically optimized and structurally protected via structure for high speed signals
IBM5 citations61
US9456506B2Sep 27, 2016
Packaging for eight-socket one-hop SMP topology
IBM0 citations51
US9445507B2Sep 13, 2016
Packaging for eight-socket one-hop SMP topology
IBM0 citations51
US7911049B2Mar 22, 2011
Electrically optimized and structurally protected via structure for high speed signals
IBM0 citations50