Inventor
LEE DEOK-HYUNG
KR43 patents
⚠️ This page may combine multiple inventors who share the name “LEE DEOK-HYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
36 patentsUS7074662B2Jul 11, 2006
Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage
SAMSUNG ELECTRONICS CO LTD176 citations99
US7141856B2Nov 28, 2006
Multi-structured Si-fin
SAMSUNG ELECTRONICS CO LTD104 citations98
US7501674B2Mar 10, 2009
Semiconductor device having fin transistor and planar transistor and associated methods of manufacture
SAMSUNG ELECTRONICS CO LTD38 citations93
US7326608B2Feb 5, 2008
Fin field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD16 citations93
US7320908B2Jan 22, 2008
Methods of forming semiconductor devices having buried oxide patterns
SAMSUNG ELECTRONICS CO LTD34 citations93
US7176067B2Feb 13, 2007
Methods of fabricating fin field effect transistors
SAMSUNG ELECTRONICS CO LTD23 citations93
US7071048B2Jul 4, 2006
Methods of fabricating fin field effect transistors having capping insulation layers
SAMSUNG ELECTRONICS CO LTD40 citations93
US7842566B2Nov 30, 2010
FinFET and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US7535061B2May 19, 2009
Fin-field effect transistors (Fin-FETs) having protection layers
SAMSUNG ELECTRONICS CO LTD23 citations92
US7534686B2May 19, 2009
Multi-structured Si-fin and method of manufacture
SAMSUNG ELECTRONICS CO LTD26 citations92
US7141456B2Nov 28, 2006
Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers
SAMSUNG ELECTRONICS CO LTD16 citations92
US7122871B2Oct 17, 2006
Integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations
SAMSUNG ELECTRONICS CO LTD35 citations92
US6890823B2May 10, 2005
Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode
SAMSUNG ELECTRONICS CO LTD28 citations92
US7385237B2Jun 10, 2008
Fin field effect transistors with low resistance contact structures
SAMSUNG ELECTRONICS CO LTD24 citations91
US8039350B2Oct 18, 2011
Methods of fabricating MOS transistors having recesses with elevated source/drain regions
SAMSUNG ELECTRONICS CO LTD9 citations84
US8008698B2Aug 30, 2011
Semiconductor memory devices having vertical channel transistors and related methods
SAMSUNG ELECTRONICS CO LTD11 citations84
US7998851B2Aug 16, 2011
Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US7683405B2Mar 23, 2010
MOS transistors having recesses with elevated source/drain regions
SAMSUNG ELECTRONICS CO LTD12 citations84
US7642589B2Jan 5, 2010
Fin field effect transistors having capping insulation layers
SAMSUNG ELECTRONICS CO LTD9 citations84
US7521301B2Apr 21, 2009
Methods for fabricating integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations
SAMSUNG ELECTRONICS CO LTD10 citations84
US7442596B2Oct 28, 2008
Methods of manufacturing fin type field effect transistors
SAMSUNG ELECTRONICS CO LTD12 citations84
US7394117B2Jul 1, 2008
Fin field effect transistors including epitaxial fins
SAMSUNG ELECTRONICS CO LTD9 citations84
US7268396B2Sep 11, 2007
Finfets having first and second gates of different resistivities
SAMSUNG ELECTRONICS CO LTD15 citations84
US7205609B2Apr 17, 2007
Methods of forming semiconductor devices including fin structures and related devices
SAMSUNG ELECTRONICS CO LTD10 citations84
US6900102B2May 31, 2005
Methods of forming double gate electrodes using tunnel and trench
SAMSUNG ELECTRONICS CO LTD13 citations84
US7683421B2Mar 23, 2010
NAND-type flash memory devices including selection transistors with an anti-punchthrough impurity region and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations83
US7652340B2Jan 26, 2010
Fin field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US7338867B2Mar 4, 2008
Semiconductor device having contact pads and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations74
US7579249B2Aug 25, 2009
Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers
SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009
Semiconductor devices having gate structures and contact pads that are lower than the gate structures
SAMSUNG ELECTRONICS CO LTD2 citations63
US7393700B2Jul 1, 2008
Low temperature methods of etching semiconductor substrates
SAMSUNG ELECTRONICS CO LTD4 citations63
US7081391B2Jul 25, 2006
Integrated circuit devices having buried insulation layers and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US6963094B2Nov 8, 2005
Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region
SAMSUNG ELECTRONICS CO LTD4 citations63
US7358588B2Apr 15, 2008
Trench isolation type semiconductor device which prevents a recess from being formed in a field region
SAMSUNG ELECTRONICS CO LTD3 citations61
US7494877B2Feb 24, 2009
Methods of forming semiconductor devices including Fin structures
SAMSUNG ELECTRONICS CO LTD0 citations52
US7795110B2Sep 14, 2010
Trench isolation type semiconductor device which prevents a recess from being formed in a field region and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations50