P

Inventor

LEE DEOK-HYUNG

KR43 patents
⚠️ This page may combine multiple inventors who share the name “LEE DEOK-HYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

36 patents
US7074662B2Jul 11, 2006

Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage

SAMSUNG ELECTRONICS CO LTD176 citations99
US7141856B2Nov 28, 2006

Multi-structured Si-fin

SAMSUNG ELECTRONICS CO LTD104 citations98
US7501674B2Mar 10, 2009

Semiconductor device having fin transistor and planar transistor and associated methods of manufacture

SAMSUNG ELECTRONICS CO LTD38 citations93
US7326608B2Feb 5, 2008

Fin field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD16 citations93
US7320908B2Jan 22, 2008

Methods of forming semiconductor devices having buried oxide patterns

SAMSUNG ELECTRONICS CO LTD34 citations93
US7176067B2Feb 13, 2007

Methods of fabricating fin field effect transistors

SAMSUNG ELECTRONICS CO LTD23 citations93
US7071048B2Jul 4, 2006

Methods of fabricating fin field effect transistors having capping insulation layers

SAMSUNG ELECTRONICS CO LTD40 citations93
US7842566B2Nov 30, 2010

FinFET and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD20 citations92
US7535061B2May 19, 2009

Fin-field effect transistors (Fin-FETs) having protection layers

SAMSUNG ELECTRONICS CO LTD23 citations92
US7534686B2May 19, 2009

Multi-structured Si-fin and method of manufacture

SAMSUNG ELECTRONICS CO LTD26 citations92
US7141456B2Nov 28, 2006

Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers

SAMSUNG ELECTRONICS CO LTD16 citations92
US7122871B2Oct 17, 2006

Integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations

SAMSUNG ELECTRONICS CO LTD35 citations92
US6890823B2May 10, 2005

Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode

SAMSUNG ELECTRONICS CO LTD28 citations92
US7385237B2Jun 10, 2008

Fin field effect transistors with low resistance contact structures

SAMSUNG ELECTRONICS CO LTD24 citations91
US8039350B2Oct 18, 2011

Methods of fabricating MOS transistors having recesses with elevated source/drain regions

SAMSUNG ELECTRONICS CO LTD9 citations84
US8008698B2Aug 30, 2011

Semiconductor memory devices having vertical channel transistors and related methods

SAMSUNG ELECTRONICS CO LTD11 citations84
US7998851B2Aug 16, 2011

Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD11 citations84
US7683405B2Mar 23, 2010

MOS transistors having recesses with elevated source/drain regions

SAMSUNG ELECTRONICS CO LTD12 citations84
US7642589B2Jan 5, 2010

Fin field effect transistors having capping insulation layers

SAMSUNG ELECTRONICS CO LTD9 citations84
US7521301B2Apr 21, 2009

Methods for fabricating integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations

SAMSUNG ELECTRONICS CO LTD10 citations84
US7442596B2Oct 28, 2008

Methods of manufacturing fin type field effect transistors

SAMSUNG ELECTRONICS CO LTD12 citations84
US7394117B2Jul 1, 2008

Fin field effect transistors including epitaxial fins

SAMSUNG ELECTRONICS CO LTD9 citations84
US7268396B2Sep 11, 2007

Finfets having first and second gates of different resistivities

SAMSUNG ELECTRONICS CO LTD15 citations84
US7205609B2Apr 17, 2007

Methods of forming semiconductor devices including fin structures and related devices

SAMSUNG ELECTRONICS CO LTD10 citations84
US6900102B2May 31, 2005

Methods of forming double gate electrodes using tunnel and trench

SAMSUNG ELECTRONICS CO LTD13 citations84
US7683421B2Mar 23, 2010

NAND-type flash memory devices including selection transistors with an anti-punchthrough impurity region and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD9 citations83
US7652340B2Jan 26, 2010

Fin field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US7338867B2Mar 4, 2008

Semiconductor device having contact pads and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations74
US7579249B2Aug 25, 2009

Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers

SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009

Semiconductor devices having gate structures and contact pads that are lower than the gate structures

SAMSUNG ELECTRONICS CO LTD2 citations63
US7393700B2Jul 1, 2008

Low temperature methods of etching semiconductor substrates

SAMSUNG ELECTRONICS CO LTD4 citations63
US7081391B2Jul 25, 2006

Integrated circuit devices having buried insulation layers and methods of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US6963094B2Nov 8, 2005

Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region

SAMSUNG ELECTRONICS CO LTD4 citations63
US7358588B2Apr 15, 2008

Trench isolation type semiconductor device which prevents a recess from being formed in a field region

SAMSUNG ELECTRONICS CO LTD3 citations61
US7494877B2Feb 24, 2009

Methods of forming semiconductor devices including Fin structures

SAMSUNG ELECTRONICS CO LTD0 citations52
US7795110B2Sep 14, 2010

Trench isolation type semiconductor device which prevents a recess from being formed in a field region and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations50

UNIV CALIFORNIA

2 patents

SON YONG-HOON

2 patents

LEE DONG-KAK

1 patent

JEONG SEONG-HOON

1 patent

LEE DEOK-HYUNG

1 patent