Inventor

KOO JA UK

KR2 patents

⚠️ This page may combine multiple inventors who share the name “KOO JA UK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOO JA UK

1 patent

US7115446B2Oct 3, 2006

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

KOO JA UK40 citations83

HYUNDAI MOTOR CO LTD

1 patent

US11786965B1Oct 17, 2023

Motor plate type coil forming apparatus

HYUNDAI MOTOR CO LTD0 citations52