Inventor
LEE JOUNG-RHANG
KR3 patents
Patents
3 patentsUS5834832ANov 10, 1998
Packing structure of semiconductor packages
SAMSUNG ELECTRONICS CO LTD52 citations92
US6670816B2Dec 30, 2003
Test coupon for measuring a dielectric constant of a memory module board and method of use
SAMSUNG ELECTRONICS CO LTD13 citations77
US7172106B2Feb 6, 2007
Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board
SAMSUNG ELECTRONICS CO LTD1 citations50