Inventor

DUONG TRUNG Q

US3 patents

⚠️ This page may combine multiple inventors who share the name “DUONG TRUNG Q”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VINCENT MICHAEL B

1 patent

US9502363B2Nov 22, 2016

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

VINCENT MICHAEL B4 citations71

MAGNUS ALAN J

1 patent

US9281293B2Mar 8, 2016

Microelectronic packages having layered interconnect structures and methods for the manufacture thereof

MAGNUS ALAN J0 citations39

FREESCALE SEMICONDUCTOR INC

1 patent

US7834466B2Nov 16, 2010

Semiconductor die with die pad pattern

FREESCALE SEMICONDUCTOR INC0 citations31