Inventor
SIM HYUN SU
KR8 patents
Patents
8 patentsUS10651105B2May 12, 2020
Semiconductor chip that includes a cover protection layer covering a portion of a passivation layer
SAMSUNG ELECTRONICS CO LTD5 citations70
US11967529B2Apr 23, 2024
Methods of manufacturing semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations60
US11710706B2Jul 25, 2023
Method of dicing a semiconductor substrate having a scribe lane defined therein
SAMSUNG ELECTRONICS CO LTD0 citations60
US11244911B2Feb 8, 2022
Chip including a scribe lane
SAMSUNG ELECTRONICS CO LTD0 citations60
US11145601B2Oct 12, 2021
Semiconductor chip including alignment pattern
SAMSUNG ELECTRONICS CO LTD1 citations60
US11107773B2Aug 31, 2021
Semiconductor device, semiconductor chip and method of dicing a semiconductor substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US10886234B2Jan 5, 2021
Semiconductor device and semiconductor package comprising the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US10854517B2Dec 1, 2020
Methods of manufacturing semiconductor chip
SAMSUNG ELECTRONICS CO LTD1 citations60