Inventor · disambiguated record
Kim Lee Bock
Also filed as: BOCK KIM LEE
6 granted patents·2 pending applications·11 citations·filing 2011–2022
72Inventor score
Top patents by PatentIndex Score
8 records- 0183US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0275US10418334B2Semiconductor device including corner recessSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·16 claims
- 0352US9038264B2Non-uniform vacuum profile die attach tipRAI PRADEEP KUMAR·Filed 2011·Granted May 26, 2015·1 cites·5 claims
- 0450US11177241B2Semiconductor device with top die positioned to reduce die crackingWESTERN DIGITAL TECH INC·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 0548US2023137512A1Stacked ssd semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2021·Application pending·0 cites
- 0646US2023411340A1Semiconductor device including embedded memory dies and method of making sameWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 0742US10128218B2Semiconductor device including die bond pads at a die edgeSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Nov 13, 2018·0 cites·24 claims
- 0838US10283485B2Semiconductor device including conductive bump interconnectionsSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted May 7, 2019·0 cites·22 claims
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