Inventor
TSENG TING-CHEN
TW8 patents
Patents
8 patentsUS11854927B2Dec 26, 2023
Semiconductor package and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12476139B2Nov 18, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412856B2Sep 9, 2025
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094765B2Sep 17, 2024
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12009226B2Jun 11, 2024
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11862594B2Jan 2, 2024
Package structure with solder resist underlayer for warpage control and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11227795B2Jan 18, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322688B2Jun 3, 2025
Package structure including auxiliary dielectric portion
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51