Inventor
GLEASON ALLAN
US17 patents
⚠️ This page may combine multiple inventors who share the name “GLEASON ALLAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
16 patentsUS6537133B1Mar 25, 2003
Method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC161 citations99
US6280290B1Aug 28, 2001
Method of forming a transparent window in a polishing pad
APPLIED MATERIALS INC165 citations99
US6045439AApr 4, 2000
Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC228 citations99
US5893796AApr 13, 1999
Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC739 citations99
US6719818B1Apr 13, 2004
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC92 citations98
US6910944B2Jun 28, 2005
Method of forming a transparent window in a polishing pad
APPLIED MATERIALS INC28 citations96
US6876454B1Apr 5, 2005
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC44 citations96
US6676717B1Jan 13, 2004
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC58 citations96
US6390904B1May 21, 2002
Retainers and non-abrasive liners used in chemical mechanical polishing
APPLIED MATERIALS INC103 citations96
US7255629B2Aug 14, 2007
Polishing assembly with a window
APPLIED MATERIALS INC24 citations92
US7118450B2Oct 10, 2006
Polishing pad with window and method of fabricating a window in a polishing pad
APPLIED MATERIALS INC19 citations92
US7011565B2Mar 14, 2006
Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC22 citations92
US6875078B2Apr 5, 2005
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC15 citations92
US6860791B2Mar 1, 2005
Polishing pad for in-situ endpoint detection
APPLIED MATERIALS INC14 citations84
US8795029B2Aug 5, 2014
Apparatus and method for in-situ endpoint detection for semiconductor processing operations
APPLIED MATERIALS INC2 citations63
US7775852B2Aug 17, 2010
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC1 citations63