Inventor
KHNG VICTOR TAN CHER
SG5 patents
Patents
5 patentsUS7145228B2Dec 5, 2006
Microelectronic devices
MICRON TECHNOLOGY INC104 citations97
US6946325B2Sep 20, 2005
Methods for packaging microelectronic devices
MICRON TECHNOLOGY INC344 citations97
US7202556B2Apr 10, 2007
Semiconductor package having substrate with multi-layer metal bumps
MICRON TECHNOLOGY INC21 citations91
US7253022B2Aug 7, 2007
Method for fabricating semiconductor package with multi-layer metal bumps
MICRON TECHNOLOGY INC9 citations72
US7550315B2Jun 23, 2009
Method for fabricating semiconductor package with multi-layer die contact and external contact
MICRON TECHNOLOGY INC2 citations61