Inventor
NAKAOKA TADAO
JP4 patents
⚠️ This page may combine multiple inventors who share the name “NAKAOKA TADAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CIRCUIT FOIL JAPAN
3 patentsUS7175920B2Feb 13, 2007
Copper foil for high-density ultra-fine printed wiring board
CIRCUIT FOIL JAPAN25 citations91
US7026059B2Apr 11, 2006
Copper foil for high-density ultrafine printed wiring boad
CIRCUIT FOIL JAPAN36 citations91
US5792333AAug 11, 1998
Method of surface-roughening treatment of copper foil
CIRCUIT FOIL JAPAN25 citations90