Inventor
JANG KYUNG-LAE
KR7 patents
Patents
7 patentsUS7327038B2Feb 5, 2008
Semiconductor device package
SAMSUNG ELECTRONICS CO LTD69 citations97
US7330084B2Feb 12, 2008
Printed circuit board having a bond wire shield structure for a signal transmission line
SAMSUNG ELECTRONICS CO LTD9 citations83
US7374969B2May 20, 2008
Semiconductor package with conductive molding compound and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD9 citations82
US7663221B2Feb 16, 2010
Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations61
US7372139B2May 13, 2008
Semiconductor chip package
SAMSUNG ELECTRONICS CO LTD3 citations61
US7652367B2Jan 26, 2010
Semiconductor package on package having plug-socket type wire connection between packages
SAMSUNG ELECTRONICS CO LTD3 citations57
US7566954B2Jul 28, 2009
Bonding configurations for lead-frame-based and substrate-based semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations41