Inventor

RIES MICHAEL JOHN

US3 patents

⚠️ This page may combine multiple inventors who share the name “RIES MICHAEL JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEMC ELECTRONIC MATERIALS

1 patent

US6339016B1Jan 15, 2002

Method and apparatus for forming an epitaxial silicon wafer with a denuded zone

MEMC ELECTRONIC MATERIALS28 citations83

RIES MICHAEL JOHN

1 patent

US8845859B2Sep 30, 2014

Systems and methods for cleaving a bonded wafer pair

RIES MICHAEL JOHN11 citations76

SUNEDISON INC

1 patent

US9281233B2Mar 8, 2016

Method for low temperature layer transfer in the preparation of multilayer semiconductor devices

SUNEDISON INC2 citations60