Inventor
MCGAHAY VINCENT
US10 patents
⚠️ This page may combine multiple inventors who share the name “MCGAHAY VINCENT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS6133136AOct 17, 2000
Robust interconnect structure
IBM77 citations93
US6939797B2Sep 6, 2005
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof
IBM26 citations91
US6737747B2May 18, 2004
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof
IBM43 citations91
US6486557B1Nov 26, 2002
Hybrid dielectric structure for improving the stiffness of back end of the line structures
IBM48 citations91
US6972209B2Dec 6, 2005
Stacked via-stud with improved reliability in copper metallurgy
IBM32 citations90
US7303994B2Dec 4, 2007
Process for interfacial adhesion in laminate structures through patterned roughing of a surface
IBM10 citations84
US7972965B2Jul 5, 2011
Process for interfacial adhesion in laminate structures through patterned roughing of a surface
IBM2 citations63