Inventor
LISK DURODAMI
US4 patents
Patents
4 patentsUS12062648B2Aug 13, 2024
Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methods
QUALCOMM INC2 citations64
US12243855B2Mar 4, 2025
Package comprising channel interconnects located between solder interconnects
QUALCOMM INC0 citations60
US12512401B2Dec 30, 2025
Integrated device substrate including embedded electromagnetic isolation structure
QUALCOMM INC0 citations59
US11817406B2Nov 14, 2023
Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methods
QUALCOMM INC0 citations42