Inventor
LIU CHING-HENG
TW4 patents
Patents
4 patentsUS12408461B2Sep 2, 2025
Semiconductor structure with isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10879123B2Dec 29, 2020
Protected chip-scale package (CSP) pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10510606B2Dec 17, 2019
Protected chip-scale package (CSP) pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10276441B2Apr 30, 2019
Protected chip-scale package (CSP) pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49