Inventor

LARNERD JAMES M

US12 patents

⚠️ This page may combine multiple inventors who share the name “LARNERD JAMES M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ENDICOTT INTERCONNECT TECH INC

7 patents

US7348677B2Mar 25, 2008

Method of providing printed circuit board with conductive holes and board resulting therefrom

ENDICOTT INTERCONNECT TECH INC19 citations92

US7211289B2May 1, 2007

Method of making multilayered printed circuit board with filled conductive holes

ENDICOTT INTERCONNECT TECH INC21 citations92

US7157646B2Jan 2, 2007

Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same

ENDICOTT INTERCONNECT TECH INC9 citations73

US7377033B2May 27, 2008

Method of making circuitized substrate with split conductive layer and information handling system utilizing same

ENDICOTT INTERCONNECT TECH INC4 citations62

US7157647B2Jan 2, 2007

Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same

ENDICOTT INTERCONNECT TECH INC2 citations62

US7814649B2Oct 19, 2010

Method of making circuitized substrate with filled isolation border

ENDICOTT INTERCONNECT TECH INC0 citations52

US7491896B2Feb 17, 2009

Information handling system utilizing circuitized substrate with split conductive layer

ENDICOTT INTERCONNECT TECH INC0 citations52

IBM

5 patents

US6105246AAug 22, 2000

Method of making a circuit board having burr free castellated plated through holes

IBM9 citations71

US4869418ASep 26, 1989