Inventor

HEDLER HARRY

DE90 patents

⚠️ This page may combine multiple inventors who share the name “HEDLER HARRY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEDLER HARRY

INFINEON TECHNOLOGIES AG

Transfer wafer level packaging

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Semiconductor component and method for its production

Method for connection of circuit units

Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another

Electronic component with flexible contacting pads and method for producing the electronic component

Stacked die package

Method for producing chip packages, and chip package produced in this way

Semiconductor circuit module and method for fabricating semiconductor circuit modules

Method of producing a semiconductor component having a compliant buffer layer

Semiconductor chip, memory module and method for testing the semiconductor chip

Electronic configuration with flexible bonding pads

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device and method for fabricating the semiconductor device

Electronic component with a semiconductor chip and method of producing the electronic component

Electronic component with a semiconductor chip and method for producing the electronic component

Configuration having an electronic device electrically connected to a printed circuit board

Method of making pad-rerouting for integrated circuit chips

Forming a structure on a wafer

Stacked die package

Integrated circuit with re-route layer and stacked die assembly

Component and method for producing a component

Flip-chip component

Semiconductor device with semiconductor components connected to one another

Connection of integrated circuits

Process for producing a semiconductor chip

Connection of integrated circuit to a substrate

Compliant relief wafer level packaging

Self-adhering chip

Method of producing an electronic component

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Method for producing a semiconductor device and corresponding semiconductor device

Method for connecting circuit devices

Electronic component with at least one semiconductor chip and method for producing the electronic component

Laser programming of integrated circuits

QIMONDA AG

Chip arrangement and method of manufacturing a chip arrangement

Method for placing material onto a target board by means of a transfer board

Solder pillar bumping and a method of making the same

Semiconductor device with stacked chips and method for manufacturing thereof

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

Integrated circuit package with a heat dissipation device

Carrier substrate and integrated circuit

Semiconductor component with improved contact pad and method for forming the same

Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel

Packaging systems and methods

Integrated circuit with re-route layer and stacked die assembly

BRUNNBAUER MARKUS

Electronic device and method for producing a device

HEDLER HARRY

Radiation detector and imaging system

SIEMENS MEDICAL SOLUTIONS USA INC

Method of manufacturing garnet interfaces and articles containing the garnets obtained therefrom