Inventor
HWANG KYUNGSEON
KR5 patents
Patents
5 patentsUS11769746B2Sep 26, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10211176B2Feb 19, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US10943881B2Mar 9, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11869878B2Jan 9, 2024
Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations59
US11171119B2Nov 9, 2021
Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations59