Inventor

RARAVIKAR NACHIKET R

US37 patents

⚠️ This page may combine multiple inventors who share the name “RARAVIKAR NACHIKET R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RARAVIKAR NACHIKET R

INTEL CORP

In-situ functionalization of carbon nanotubes

In-situ functionalization of carbon nanotubes

Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance

Nanostructure-based package interconnect

Carbon nanotube-based stress sensor

Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same

Semiconductor package with electromagnetic interference shielding

Method to fabricate self-healing material

Electromagnetic interference shielding for system-in-package technology

Systems and methods for electromagnetic interference shielding

LPS solder paste based low cost fine pitch pop interconnect solutions

Multi-chip packages and sinterable paste for use with thermal interface materials

Methods of utilizing low temperature solder assisted mounting techniques for package structures

Method and materials for warpage thermal and interconnect solutions

Heat spreader edge standoffs for managing bondline thickness in microelectronic packages

Heat spreader edge standoffs for managing bondline thickness in microelectronic packages

LPS solder paste based low cost fine pitch pop interconnect solutions

Varied ball ball-grid-array (BGA) packages

Sintered solder for fine pitch first-level interconnect (FLI) applications

Systems and methods for electromagnetic interference shielding

Flexible underfill compositions for enhanced reliability

Space transformer with perforated metallic plate for electrical die test

Computing system with a thermal interface comprising magnetic particles

Sintered solder for fine pitch first-level interconnect (FLI) applications

Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging

RARAVIKAR NACHIKET R

Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same

Integrated microelectronic package temperature sensor

Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same

XU DINGYING

Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die

Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die

FARAHANI MOHAMMAD M

Stress sensor for in-situ measurement of package-induced stress in semiconductor devices

Stress sensor for in-situ measurement of package-induced stress in semiconductor devices

SHEKHAWAT LINDA A

Thermally and electrically conductive structure comprising a carbon nanotube and a carbon coating, and method of reducing a contact resistance of same

Method for reducing contact resistance of a thermally and electrically conductive structure comprising carbon nanotube

RENSSELAER POLYTECH INST

Ultrafast all-optical switch using carbon nanotube polymer composites

XIU YONGHAO

Epoxy-amine underfill materials for semiconductor packages

KARHADE OMKAR G

Method and materials for warpage thermal and interconnect solutions