Inventor

MANEPALLI RAHUL

US28 patents

⚠️ This page may combine multiple inventors who share the name “MANEPALLI RAHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MANEPALLI RAHUL

INTEL CORP

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

Surface treatment for microelectronic device substrate

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

Chiplet first architecture for die tiling applications

Chiplet first architecture for die tiling applications

Chiplet first architecture for die tiling applications

Chiplet first architecture for die tiling applications

Hybrid conductive vias for electronic substrates

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

Glass core patch with in situ fabricated fan-out layer to enable die tiling applications

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

Customizable release layers to enable low warpage architectures for advanced packaging applications

Patternable die attach materials and processes for patterning

Patternable die attach materials and processes for patterning

Hybrid fine line spacing architecture for bump pitch scaling

Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures

Package architecture with improved via drill process and method for forming such package

Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates

Dielectric-to-metal adhesion promotion material

Flip chip package containing novel underfill materials

Multi-package assemblies having foam structures for warpage control

Selective metal deposition by patterning direct electroless metal plating

Electroless plating process

XU DINGYING

Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die

Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die