Inventor

CHEN CHENG-TING

TW45 patents

⚠️ This page may combine multiple inventors who share the name “CHEN CHENG-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN CHENG-TING

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated fan-out packages with embedded heat dissipation structure

Semiconductor packaging structure and method

Interconnect structure and method of fabricating same

Package structure

Warpage control in the packaging of integrated circuits

Package structure

Integrated fan-out packages with embedded heat dissipation structure

Stud bump structure for semiconductor package assemblies

Manufacturing method of package on package structure

Warpage control in the packaging of integrated circuits

Interconnect joint protective layer apparatus and method

Semiconductor packaging structure and method

Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure

Package structure and method of forming the same

Warpage control in the packaging of integrated circuits

Manufacturing method of package on package structure

Iintegrated fan-out packages with embedded heat dissipation structure

Package structure

Manufacturing method of package on package structure

Method of singulate a package structure using a light transmitting film on a polymer layer

System and method to reduce pre-back-grinding process defects

System and method for an improved fine pitch joint

Semiconductor packaging and manufacturing method thereof

Semiconductor packaging structure and method

Plasma treatment for semiconductor devices

Package structure and method of forming the same

Method and apparatus for localized and controlled removal of material from a substrate

TAIWAN SEMICONDUCTOR MFG

System and method for an improved fine pitch joint

Package on package structure and method of manufacturing the same

Package on package structure and method of manufacturing the same

Reflow process and tool

Semiconductor packaging and manufacturing method thereof

System and method for fine pitch PoP structure

Method for wafer separation

IND TECH RES INST

Solar cell substrate with thin film polysilicon

Method for fabricating solar cells

LU CHEN-FA

Plasma treatment for semiconductor devices

System and method to reduce pre-back-grinding process defects

LIN CHUN-CHENG

Semiconductor packaging structure and method

LIN CHENG-CHUNG

System and method for fine pitch PoP structure

LIN HSIU-JEN

Methods for performing reflow in bonding processes

CHEN MENG-TSE

Stud bump structure for semiconductor package assemblies

CHENG MING-DA

Warpage control in the packaging of integrated circuits

LIN HSIU JEN

Method of processing solder bump by vacuum annealing

CHEN CHENG TING

Safety helmet inner lining adjustable for suitable wearing