Inventor

HOSONO NORIYOSHI

JP2 patents

⚠️ This page may combine multiple inventors who share the name “HOSONO NORIYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU POLYMER CO

1 patent

US7875501B2Jan 25, 2011

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

SHINETSU POLYMER CO19 citations89

TANAKA KIYOFUMI

1 patent

US8212345B2Jul 3, 2012

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

TANAKA KIYOFUMI4 citations54