Inventor

FUJIMOTO HIRONOBU

JP7 patents

⚠️ This page may combine multiple inventors who share the name “FUJIMOTO HIRONOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LINTEC CORP

2 patents

US9023913B2May 5, 2015

Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body

LINTEC CORP1 citations50

US9102833B2Aug 11, 2015

Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body

LINTEC CORP0 citations39

SHINETSU POLYMER CO

1 patent

US7875501B2Jan 25, 2011

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

SHINETSU POLYMER CO19 citations89

WATANABE KENICHI

1 patent

US8182649B2May 22, 2012

Fixed jig, chip pickup method and chip pickup apparatus

WATANABE KENICHI7 citations82

FUJIMOTO HIRONOBU

1 patent

US9534151B2Jan 3, 2017

Sheet and adhesive sheet

FUJIMOTO HIRONOBU9 citations73

TOKUYAMA CORP

1 patent

US11884596B2Jan 30, 2024

Method for producing granules for ceramic production

TOKUYAMA CORP0 citations61

TANAKA KIYOFUMI

1 patent

US8212345B2Jul 3, 2012

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

TANAKA KIYOFUMI4 citations54