Inventor
MIYOSHI HIROMASA
JP13 patents
⚠️ This page may combine multiple inventors who share the name “MIYOSHI HIROMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DOWA ELECTRONICS MATERIALS CO LTD
7 patentsUS10328534B2Jun 25, 2019
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD2 citations68
US11453053B2Sep 27, 2022
Joining material and joining method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations60
US10903185B2Jan 26, 2021
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations55
US10543569B2Jan 28, 2020
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations50
US10821558B2Nov 3, 2020
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US9662748B2May 30, 2017
Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method
DOWA ELECTRONICS MATERIALS CO LTD1 citations48
US9914845B2Mar 13, 2018
Fine silver particle dispersing solution
DOWA ELECTRONICS MATERIALS CO LTD0 citations46
DOWA MINING CO
5 patentsUS6620344B2Sep 16, 2003
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
DOWA MINING CO13 citations91
US6875252B2Apr 5, 2005
Copper powder and process for producing copper powder
DOWA MINING CO15 citations82
US6881240B2Apr 19, 2005
Copper powder for electrically conductive paste
DOWA MINING CO7 citations73
US6923924B2Aug 2, 2005
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
DOWA MINING CO7 citations72
US7235119B2Jun 26, 2007
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
DOWA MINING CO2 citations61