Inventor

XIAO FUQIANG

CN4 patents

⚠️ This page may combine multiple inventors who share the name “XIAO FUQIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WESTERN DIGITAL TECH INC

2 patents

US12051660B2Jul 30, 2024

Wire bond pad design for compact stacked-die package

WESTERN DIGITAL TECH INC0 citations57

US11189582B2Nov 30, 2021

Wire bond pad design for compact stacked-die package

WESTERN DIGITAL TECH INC0 citations57

LU ZHONG

1 patent

US9704797B2Jul 11, 2017

Waterfall wire bonding

LU ZHONG11 citations77

SANDISK INFORMATION TECH SHANGHAI CO LTD

1 patent

US10177119B2Jan 8, 2019

Fan out semiconductor device including a plurality of semiconductor die

SANDISK INFORMATION TECH SHANGHAI CO LTD6 citations71