Inventor
DAS MAHAPATRA SUSMRITI
US3 patents
Patents
3 patentsUS11817369B2Nov 14, 2023
Lids for integrated circuit packages with solder thermal interface materials
INTEL CORP0 citations58
US12166004B2Dec 10, 2024
Solder thermal interface material (STIM) with dopant
INTEL CORP1 citations57
US12040246B2Jul 16, 2024
Chip-scale package architectures containing a die back side metal and a solder thermal interface material
INTEL CORP1 citations55