Inventor
FALOLA BAMIDELE DANIEL
US6 patents
Patents
6 patentsUS12588499B2Mar 24, 2026
Integrated circuit heat spreader including sealant interface material
INTEL CORP1 citations61
US11798861B2Oct 24, 2023
Integrated heat spreader (IHS) with heating element
INTEL CORP0 citations59
US11817369B2Nov 14, 2023
Lids for integrated circuit packages with solder thermal interface materials
INTEL CORP0 citations58
US11670569B2Jun 6, 2023
Channeled lids for integrated circuit packages
INTEL CORP1 citations58
US12166004B2Dec 10, 2024
Solder thermal interface material (STIM) with dopant
INTEL CORP1 citations57
US12183688B2Dec 31, 2024
Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE
INTEL CORP0 citations54