Inventor

KOH KYONGHWAN

KR3 patents

Patents

3 patents

US11508713B2Nov 22, 2022

Methods of manufacturing semiconductor package and package-on-package

SAMSUNG ELECTRONICS CO LTD0 citations59

US12400970B2Aug 26, 2025

Semiconductor package including electromagnetic shield structure

SAMSUNG ELECTRONICS CO LTD0 citations58

US12308253B2May 20, 2025

Molded product for semiconductor strip and method of manufacturing semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations47