Inventor
HO BENG YEUNG
SG6 patents
⚠️ This page may combine multiple inventors who share the name “HO BENG YEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UTAC HEADQUARTERS PTE LTD
5 patentsUS9978658B2May 22, 2018
Semiconductor packages and methods of packaging semiconductor devices
UTAC HEADQUARTERS PTE LTD8 citations81
US9508623B2Nov 29, 2016
Semiconductor packages and methods of packaging semiconductor devices
UTAC HEADQUARTERS PTE LTD5 citations81
US9570314B2Feb 14, 2017
Methods for singulating semiconductor wafer
UTAC HEADQUARTERS PTE LTD3 citations68
US10354934B2Jul 16, 2019
Semiconductor packages and methods of packaging semiconductor devices
UTAC HEADQUARTERS PTE LTD0 citations49
US9741619B2Aug 22, 2017
Methods for singulating semiconductor wafer
UTAC HEADQUARTERS PTE LTD0 citations47