Inventor
KIM KWANG HO
US117 patents
⚠️ This page may combine multiple inventors who share the name “KIM KWANG HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK TECHNOLOGIES LLC
16 patentsUS10510738B2Dec 17, 2019
Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof
SANDISK TECHNOLOGIES LLC104 citations98
US10861873B2Dec 8, 2020
Three-dimensional memory device including signal and power connection lines extending through dielectric regions and methods of making the same
SANDISK TECHNOLOGIES LLC23 citations94
US10727215B1Jul 28, 2020
Three-dimensional memory device with logic signal routing through a memory die and methods of making the same
SANDISK TECHNOLOGIES LLC21 citations94
US11569215B2Jan 31, 2023
Three-dimensional memory device with vertical field effect transistors and method of making thereof
SANDISK TECHNOLOGIES LLC19 citations86
US11342244B2May 24, 2022
Bonded assembly of semiconductor dies containing pad level across-die metal wiring and method of forming the same
SANDISK TECHNOLOGIES LLC7 citations86
US10923196B1Feb 16, 2021
Erase operation in 3D NAND
SANDISK TECHNOLOGIES LLC13 citations86
US10872899B2Dec 22, 2020
Three-dimensional memory device including signal and power connection lines extending through dielectric regions and methods of making the same
SANDISK TECHNOLOGIES LLC17 citations86
US11011209B2May 18, 2021
Three-dimensional memory device including contact-level bit-line-connection structures and methods of making the same
SANDISK TECHNOLOGIES LLC8 citations84
US9748001B2Aug 29, 2017
Bad column management with bit information in non-volatile memory systems
SANDISK TECHNOLOGIES LLC15 citations84
US11791327B2Oct 17, 2023
Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof
SANDISK TECHNOLOGIES LLC4 citations75
US11676954B2Jun 13, 2023
Bonded three-dimensional memory devices with backside source power supply mesh and methods of making the same
SANDISK TECHNOLOGIES LLC3 citations73
US11296113B2Apr 5, 2022
Three-dimensional memory device with vertical field effect transistors and method of making thereof
SANDISK TECHNOLOGIES LLC3 citations73
US11133297B2Sep 28, 2021
Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof
SANDISK TECHNOLOGIES LLC4 citations73
US11074976B2Jul 27, 2021
Temperature dependent impedance mitigation in non-volatile memory
SANDISK TECHNOLOGIES LLC5 citations73
US11031308B2Jun 8, 2021
Connectivity detection for wafer-to-wafer alignment and bonding
SANDISK TECHNOLOGIES LLC6 citations73
US10910064B2Feb 2, 2021
Location dependent impedance mitigation in non-volatile memory
SANDISK TECHNOLOGIES LLC3 citations73
SAMSUNG ELECTRONICS CO LTD
8 patentsUS5768898AJun 23, 1998
Refrigerator having fluorescent lamp for illuminating fresh food compartment
SAMSUNG ELECTRONICS CO LTD65 citations96
US10354740B2Jul 16, 2019
Three-dimensional semiconductor memory devices including first contact having a stepwise profile at interface between two portions
SAMSUNG ELECTRONICS CO LTD14 citations91
US10642305B2May 5, 2020
High-accuracy CMOS temperature sensor and operating method
SAMSUNG ELECTRONICS CO LTD11 citations86
US8023320B2Sep 20, 2011
Resistance-change random access memory device including memory cells connected to discharge elements
SAMSUNG ELECTRONICS CO LTD10 citations84
US7952956B2May 31, 2011
Variable resistance memory device and system
SAMSUNG ELECTRONICS CO LTD15 citations84
US9348521B2May 24, 2016
Semiconductor storage device and method of throttling performance of the same
SAMSUNG ELECTRONICS CO LTD5 citations83
US10276591B2Apr 30, 2019
Vertical memory device
SAMSUNG ELECTRONICS CO LTD8 citations79
US11231736B2Jan 25, 2022
Reference voltage generating circuit method of generating reference voltage and integrated circuit including the same
SAMSUNG ELECTRONICS CO LTD2 citations73
SANDISK TECHNOLOGIES INC
6 patentsUS9552882B2Jan 24, 2017
Sense amplifier with efficient use of data latches
SANDISK TECHNOLOGIES INC22 citations94
US9437302B2Sep 6, 2016
State-dependent lockout in non-volatile memory
SANDISK TECHNOLOGIES INC16 citations92
US8908432B2Dec 9, 2014
Bit line resistance compensation
SANDISK TECHNOLOGIES INC10 citations84
US8879331B2Nov 4, 2014
Shared bit line string architecture
SANDISK TECHNOLOGIES INC8 citations84
US8743618B1Jun 3, 2014
Bit line resistance compensation
SANDISK TECHNOLOGIES INC14 citations84
US9721671B2Aug 1, 2017
Memory device which performs verify operations using different sense node pre-charge voltages and a common discharge period
SANDISK TECHNOLOGIES INC15 citations83
KOREA INST SCI & TECH
5 patentsUS6806624B2Oct 19, 2004
Microelectromechanical generator using bubbles
KOREA INST SCI & TECH35 citations92
US7329959B2Feb 12, 2008
Micro power generator and apparatus for producing reciprocating movement
KOREA INST SCI & TECH51 citations89
US6750596B2Jun 15, 2004
Generator for use in a microelectromechanical system
KOREA INST SCI & TECH30 citations88
US6038869AMar 21, 2000
Method and apparatus for making spherical ice particles
KOREA INST SCI & TECH19 citations88
US7034440B2Apr 25, 2006
Generator for use with a micro system having dual diaphragms
KOREA INST SCI & TECH19 citations81
FRONTICS INC
3 patentsUS7472603B2Jan 6, 2009
Evaluating method of the residual stress determining method using the continuous indentation method
FRONTICS INC15 citations84
US9702798B1Jul 11, 2017
Method for evaluating fracture toughness using instrumented indentation testing
FRONTICS INC14 citations80
US7487051B2Feb 3, 2009
Evaluating method of the fracture toughness using the continuous indentation method
FRONTICS INC8 citations79
KIM JIN SEONG
2 patentsSHE MIN
2 patentsLG ELECTRONICS INC
2 patentsLIU BO
1 patentHEWLETT PACKARD CO
1 patentLI YAN
1 patentLEE JAE GON
1 patentLG INNOTEK CO LTD
1 patentKIM KWANG-HO
1 patentShowing the top 50 of 117 patents by PatentIndex Score.