P

Inventor

KIM KWANG HO

US117 patents
⚠️ This page may combine multiple inventors who share the name “KIM KWANG HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK TECHNOLOGIES LLC

16 patents
US10510738B2Dec 17, 2019

Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof

SANDISK TECHNOLOGIES LLC104 citations98
US10861873B2Dec 8, 2020

Three-dimensional memory device including signal and power connection lines extending through dielectric regions and methods of making the same

SANDISK TECHNOLOGIES LLC23 citations94
US10727215B1Jul 28, 2020

Three-dimensional memory device with logic signal routing through a memory die and methods of making the same

SANDISK TECHNOLOGIES LLC21 citations94
US11569215B2Jan 31, 2023

Three-dimensional memory device with vertical field effect transistors and method of making thereof

SANDISK TECHNOLOGIES LLC19 citations86
US11342244B2May 24, 2022

Bonded assembly of semiconductor dies containing pad level across-die metal wiring and method of forming the same

SANDISK TECHNOLOGIES LLC7 citations86
US10923196B1Feb 16, 2021

Erase operation in 3D NAND

SANDISK TECHNOLOGIES LLC13 citations86
US10872899B2Dec 22, 2020

Three-dimensional memory device including signal and power connection lines extending through dielectric regions and methods of making the same

SANDISK TECHNOLOGIES LLC17 citations86
US11011209B2May 18, 2021

Three-dimensional memory device including contact-level bit-line-connection structures and methods of making the same

SANDISK TECHNOLOGIES LLC8 citations84
US9748001B2Aug 29, 2017

Bad column management with bit information in non-volatile memory systems

SANDISK TECHNOLOGIES LLC15 citations84
US11791327B2Oct 17, 2023

Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof

SANDISK TECHNOLOGIES LLC4 citations75
US11676954B2Jun 13, 2023

Bonded three-dimensional memory devices with backside source power supply mesh and methods of making the same

SANDISK TECHNOLOGIES LLC3 citations73
US11296113B2Apr 5, 2022

Three-dimensional memory device with vertical field effect transistors and method of making thereof

SANDISK TECHNOLOGIES LLC3 citations73
US11133297B2Sep 28, 2021

Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof

SANDISK TECHNOLOGIES LLC4 citations73
US11074976B2Jul 27, 2021

Temperature dependent impedance mitigation in non-volatile memory

SANDISK TECHNOLOGIES LLC5 citations73
US11031308B2Jun 8, 2021

Connectivity detection for wafer-to-wafer alignment and bonding

SANDISK TECHNOLOGIES LLC6 citations73
US10910064B2Feb 2, 2021

Location dependent impedance mitigation in non-volatile memory

SANDISK TECHNOLOGIES LLC3 citations73

SAMSUNG ELECTRONICS CO LTD

8 patents

SANDISK TECHNOLOGIES INC

6 patents

KOREA INST SCI & TECH

5 patents

FRONTICS INC

3 patents

KIM JIN SEONG

2 patents

SHE MIN

2 patents

LG ELECTRONICS INC

2 patents

LIU BO

1 patent

HEWLETT PACKARD CO

1 patent

LI YAN

1 patent

LEE JAE GON

1 patent

LG INNOTEK CO LTD

1 patent

KIM KWANG-HO

1 patent

Showing the top 50 of 117 patents by PatentIndex Score.